I dont get this - you can just print with SMD paste and then reflow the whole thing at once - though you will need high temp materials to do that, but several amateurs have done it.
Afaik there are a lot more high temp UV resins you can print with.
once one can make traces in 3D as part of a case/shell/frame/structure things get _very_ interesting --- consider that one electronics designer actually worked up a 3D CAD system:
>My primary use case for 3D CAD is designing 3D-printed enclosures for my electronics projects.
So, imagine what folks like that will make when they are able to 3D print a full circuit board as part of a structure, with components place/oriented in it in novel ways (heat dissipation? LEDs to indicate status?)....
Though, I generally like the idea of circuit traces embedded directly in mechanical design of a product, I suppose this would make devices completely and utterly non-repairable. Not that there's something new in this, but imagine, debugging a 3d volumetric circuit, where chips and discrete components baked solid into medium? And I also wonder, where such super high level of integration would be necessary, other than medical/wearable/implantable devices...
If you can print small enough with this technology I'm pretty sure you can make transistors - sort of 1980 era transistors, not very dense, but if you are printing bulk materials you can build in 3D rather than 2D, make interesting numbers of transistors, cpus in everything!
The article reads like they are talking about the traces. What about components like surface mount resistors, IC's, etc?
The examples I noticed were things like antennas, grids, a microspring. I didn't see anything resembling a full circuit.
I dont get this - you can just print with SMD paste and then reflow the whole thing at once - though you will need high temp materials to do that, but several amateurs have done it.
Afaik there are a lot more high temp UV resins you can print with.
Reflowing smd paste inside print won't work reliably as the solder will tend to form blobs instead of keeping the track shape
Components are pretty easily done via pick-and-place, which was just demonstrated on video:
https://www.youtube.com/watch?v=MGZ0qpPN1uk
once one can make traces in 3D as part of a case/shell/frame/structure things get _very_ interesting --- consider that one electronics designer actually worked up a 3D CAD system:
https://dune3d.org/
just for making 3D printed enclosures:
>My primary use case for 3D CAD is designing 3D-printed enclosures for my electronics projects.
So, imagine what folks like that will make when they are able to 3D print a full circuit board as part of a structure, with components place/oriented in it in novel ways (heat dissipation? LEDs to indicate status?)....
Though, I generally like the idea of circuit traces embedded directly in mechanical design of a product, I suppose this would make devices completely and utterly non-repairable. Not that there's something new in this, but imagine, debugging a 3d volumetric circuit, where chips and discrete components baked solid into medium? And I also wonder, where such super high level of integration would be necessary, other than medical/wearable/implantable devices...
They are produced by companies that specialise in producing ICs.
They can be placed manually or automated.
If you can print small enough with this technology I'm pretty sure you can make transistors - sort of 1980 era transistors, not very dense, but if you are printing bulk materials you can build in 3D rather than 2D, make interesting numbers of transistors, cpus in everything!